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关键词:TS2260
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IBM System Storage TS2260 Tape Drive Express IBM? System Storage? TS2260 Tape Drive Model H6S is designed to deliver IBM tape reliability and performance at open systems prices. Features of the new Ultrium? 6 model include: Specification data transfer rate of up to 160 MB/sec native compared to 140 MB/sec native for Linear Tape-Open? ( LTO? ) Ultrium 5 Support for LTO Generation 6 media specification tape cartridge compressed capacity of up to 6.25 TB with 2.5 to 1 compression The ability to read and write on Ultrium 6 and Ultrium 5 data cartridges, and read Ultrium 4 data cartridges 6 Gbps Serial Attached SCSI (SAS) attachment for Model H6S Encryption support in the tape drive to work with application managed encryption 19-inch rack mount shelf option to accommodate two TS2260 Tape Drives side by side in the rack using just 2U of rack space Dual SAS ports per drive to improve availability IBM Long Term File System (LTFS) Single Drive Edition (SDE) for partitioning support Half-high drive form factor The TS2260 Model H6S tape drive uses a 6 Gbps dual port SAS interface for connection to a wide spectrum of system servers. The new TS2260 attaches to IBM System x? and PC servers, and selected IBM Power Systems? models. The TS2260 also supports Microsoft? Windows? , HP-UX, Oracle Solaris, and UNIX? . The following IBM TS2260 Model H6S half-high LTO Ultrium 6 tape drive enhancements are designed to help improve performance, capacity, and reliability: Native LTO Generation 6 media specification data transfer rate of up to 160 MB/sec Support for LTO Generation 6 media specification tape cartridge compressed capacity of up to 6.25 TB with 2.5 to 1 compression 6 Gbps SAS attachment support A 512 MB internal buffer Application managed encryption support for half-high LTO Generation 6 SAS tape drives 16 KB cartridge memory with Ultrium 6 media Half-high drive form factor Two SAS ports per drive to improve availability and attachability IBM LTFS partitioning support Better integrated electronics using IBM engineered copper technology
